• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to a method for the selective coating of smooth surface areas of a film element, comprising a lacquer layer having a functional layer, characterized by the following method steps: a) providing a carrier substrate, b) applying a: radiation-curing lacquer layer high surface energy, c) introduction of microchannels into at least a first part of the radiation-curable lacquer layer, d) hardening of the radiation-curable lacquer layer, e) application of a lift-off lacquer layer which can be dissolved in a solvent or in water , wherein this lacquer layer wets and fills exclusively the microchannels, f) applying a functional layer and g) removing the lacquer layer soluble in a solvent or water by the action of a solvent or water.
    公开号:AT520010A1
    申请号:T204/2017
    申请日:2017-05-16
    公开日:2018-12-15
    发明作者:Dieter Nees Dr；Barbara Stadlober Dr
    申请人:Joanneum Res Forschungsgmbh；
    IPC主号:
    专利说明:

    Process for the selective coating of surface areas of a lacquer layer
    The invention relates to a method for the selective coating of smooth surface areas of lacquer layers or film elements for technical applications.
    In the manufacture of optical elements, such as lenses, light filters, and electronic components, such as sensors, decorative elements and the like, a selective, precisely fitting coating of (smooth) surface areas with metallic or other types (for example semiconducting or dielectric or sensory) layers is absolutely necessary.
    It was an object of the present invention to provide a method for the selective coating of (in particular smooth) surface areas, in which an exact fit of the smooth surface area with a metallic (reflection) or other type of layer is ensured.
    The invention therefore relates to a method for the selective coating of surface areas of a lacquer layer with a functional layer, characterized by the following method steps:
    a) Providing a carrier substrate
    b) applying a radiation-curable embossing lacquer layer
    c) introducing microchannels into at least a portion of the radiation-curable lacquer layer
    d) curing the radiation-curable lacquer layer
    e) Application of a lift-off lacquer layer which is soluble in a solvent or in water, this lacquer layer exclusively wetting and filling the microchannels.
    / 21
    .. ::: .. :: ': 2 :::
    • ····· · · ·· · ··· · ····· ·· ·· ··· ···· ·· ··
    f) application of a further functional layer
    g) removing the paint layer which is soluble in a solvent or water by the action of a solvent or water at the same time as the functional layer above it.
    By pre-structuring using an embossing process, a defined, locally limited wetting of different paints on a film surface is achieved. In combination with subsequent coating in a vacuum (e.g. sputtering, vapor deposition, CVD) or from the liquid phase (gravure printing, slot nozzle, doctor blade, etc.) and lift-off, this can be used to produce a self-adjusted, locally limited coating and wetting (e.g. in a printing process ) be used. In particular, this enables the self-aligned and selective coating of surfaces with sufficiently flat (nano) structures or smooth surfaces using functional films made of metals, metal oxides, semiconductors or CVD polymers.
    The carrier substrates are, for example, carrier films, preferably flexible plastic films, for example made of PI, PP, MOPP, PE, PPS, PEEK, PEK, PEI, PSU, PAEK, LCP, PEN, PBT, PET, PA, PC, COC, POM, ABS, PVC , PTFE, ETFE (ethylene tetrafluoroethylene), PTFE (polytetra-fluorethylene), PVF (polyvinyl fluoride), PVDF (polyvinylidene fluoride), and EFEP (ethylene tetrafluoroethylene hexafluoropropylene fluoropolymer).
    The carrier films preferably have a thickness of 5 to 700 μm, preferably 5 200 μm, particularly preferably 5 to 50 μm.
    A radiation-curable embossing lacquer layer is applied to the carrier substrate.
    / 21: :: 3: · :: :: ..
    • · · · · ····· · • · · · · · ··· ·· ·· ···· ··· ·· ··
    Microchannels are introduced into this embossing lacquer layer in at least one first sub-area and, if necessary, nanostructures in at least a second area.
    If the lacquer layer is to have smooth surface areas, only the microchannels are introduced in addition to these smooth surface areas.
    Embossing processes are particularly suitable for introducing the nanostructures and microchannels, in which the embossing tool is preferably designed such that both the nanostructures and the microchannels are introduced into the radiation-curable embossing lacquer layer in one operation.
    Microchannels are understood here to mean structures which have a depth of 1,200 μm, preferably 1-20 μm and a width of 1-200 μm. The depth to width ratio is> 1. The microchannels have a geometry with a tapering cross section, preferably a V-shaped geometry or a geometry with convex edges
    After the embossing lacquer layer has hardened, preferably under UV radiation or by means of an electron beam, a lift-off lacquer layer which is soluble in a solvent, for example in an organic solvent or in water, is applied.
    The embossing lacquer layer must be matched to the lift-off lacquer layer applied after the microchannels have been introduced, so that only the microchannels are wetted and filled by the lift-off lacquer layer, the so-called wicking effect being used according to the invention.
    For example, if the lift-off lacquer layer is a water-soluble lacquer layer, the embossed lacquer layer must have a high surface energy.
    / 21
    .. ::: .. :: ·: * ·::
    • ····· · · ·· · ··· · ····· ·· ·· ··· ···· ·· ··
    The wicking effect, i.e. the spontaneous wetting of a microchannel with a liquid (e.g. a lift-off lacquer), is based on an exact coordination of the surface energy of the embossing lacquer and the lift-off lacquer (characterized by the contact angle Θ that the lift-off lacquer on a smooth surface of the embossing lacquer) and the geometry of the microchannels (characterized by the opening angle α of a channel with a cross section tapering downwards, for example a channel with a V-shaped cross section) described by the following formula:
    θ <φ = 90 ° -a / 2 φ here is the edge angle of the side walls with the horizontal. Formula I is the so-called Concus-Finn relation (P. Concus and R. Finn: On a class of capillary surfaces. J. Analyze Math. 23 (1970), 65-70.), Which describes that a liquid (here Lift-off lacquer) a V-shaped channel (in the embossing lacquer material) and only wet it spontaneously if the contact angle is smaller than the edge angle. For small channel opening angles, the Concus-Finn relation enables completely unimpeded wetting and filling of the channel for many liquids. The relation is also valid, for example, for a channel, the side walls of which are formed from two circular cylinders, which creates an opening angle of 0 ° - at the top - or at the bottom of the trench. In order to understand the wicking behavior on structured surfaces, Formula II is also important cosO c e <e c
    Here 0 C means the critical contact angle of the lift-off lacquer on a rough or structured embossing surface, which is geometrically determined and must be undercut for the wetting or filling of a lift-off lacquer in the channels. The / 21: :: 5: · :: :: ..
    • · · · · ····· · ·· ·· ···· ··· ·· ·· critical contact angle is determined by the roughness factor r and the plateau area component Φ δ (proportion of the non-wetted area of the microchannels) (cf. Fig. 1a).
    If condition II is met, hemi-wicking occurs, i.e. only the channels are filled, while the plateau surfaces remain dry.
    The roughness factor is the quotient of the true surface and its horizontal projection, as described, for example, in Dinesh Chandra et al., "Dynamics of a droplet imbibing on a rough surface", Langmuir 2011, 27, 13401-13405.
    The plateau area portion lä δ represents the portion of the non-wetted area of the microchannels. This is minimized according to the invention (Φ δ ~ 0) in order to achieve a completely selective wetting of the microchannels in the area of the microchannels.
    By utilizing the wicking effect, the embossing lacquer layer is only wetted by the lift-off lacquer in the area of the microchannels, in the area of the flat nanostructures there is no wetting due to the build-up of the lift-off lacquer.
    The larger the critical angle 0 c , i.e. the larger the roughness factor according to the above formula and the smaller the proportion of plateau area of the microchannels Φε, the more freedom of design there is with the surface energy of the embossing lacquer.
    Only if condition I and condition II are met does a complete spontaneous and exclusive wetting and filling of microchannels (with a non-rectangular cross-section) take place with a lift-off lacquer, whereby the plateau surfaces (with flat nanostructures) remain completely unwetted.
    / 21
    Particularly suitable UV-crosslinkable embossing lacquer compositions are, for example, embossing lacquers based on polyethylene glycol diacrylates (PEGDA), optionally with 1-10% by mass of higher-functional acrylates, such as trimethylolpropane triacrylate (TMPTA) or pentaerythritol tetraacrylate (PETTA) or mixtures of acryloyl-morpholine (ACMO) 10 - 50% by mass of higher functional acrylates, such as trimethylolpropane triacrylate (TMPTA) or pentaerythritol tetraacrylate (PETTA).
    The embossing lacquer compositions contain 0.5-5% photoinitiators, which bring about crosslinking under UV radiation. Particularly suitable photoinitiators are, for example, photoinitiators based on acylphosphine oxides such as Iragure 819®, Genocure TPO®, Genocure BAPO® or oligomeric polyfunctional alpha hydroxy ketones such as Esacure KIP 150®, monomeric alpha hydroxy ketones such as Esacure KL 200®, Genocure DMHA® or Darocure 1173 ®. Mixtures of these photoinitiators can also be used
    Particularly suitable lift-off lacquer compositions are, for example, hydroxyethylcaprolactone acrylate such as HECLA® from BASF or Miramer M100® from Miwon, ethoxyethoxyethyl acrylate such as Miramer M170® from Miwon or EDGA® from BASF, 2-ethoxyethylacrylate such as Viscoat 190® from Kowa, tetrahydrofurfamerla50ylate such as Mir from Miwon or Sartomer 302®, Viscoat 150®, gamma-butylolactone acrylate such as GBLA® from Kowa, 4Acryloylmorpholin such as ACMO® from Rahn or Luna ACMO® from DKSH, hydroxypropyl acrylate such as HPA® from BASF, isobornyl acrylate such as IBOA® from Allnex or IBXA Kowa.
    These lift-off lacquer compositions contain 0.5-5% of photoinitiators, such as photoinitiators based on acylphosphine oxides, such as Iragure 819®, Genocure TPO®, Genocure BAPO® or oligomeric polyfunctional alpha hydroxy ketones such as Esacure KIP 150®, monomeric alpha hydroxy ketones, like / 21
    Esacure KL 200®, Genocure DMHA® or Darocure 1173®. Mixtures of these photoinitiators can also be used.
    Isobornyl acrylate can be used as a lift-off lacquer due to its low surface tension and thus a low contact angle, also in conjunction with embossing lacquers with a lower surface energy, such as polyurethane acrylate-based embossing lacquers.
    The lift-off lacquer can either contain polar residual groups such as 4Acryloylmorpholine (ACMO) or non-polar residual groups such as isobornyl acrylate, depending on the surface energy of the embossing lacquer layer.
    The lift-off varnish layer can also only be printed in the area of the microchannels; any fluctuations in the register are compensated for by wetting the microchannels.
    A second functional layer, for example a metallic reflection layer, is then applied to the lift-off lacquer layer. The functional layer is preferably deposited by PVD or CVD processes (also initiated CVD or oxygenated CVD), for example by thermal evaporation, by sputtering or electron beam evaporation. However, separation from the liquid phase is also possible if the solvent / liquid is orthogonal to the lift-off lacquer, i.e. the solvent / liquid does not dissolve the lift-off lacquer, and even thin films can be created.
    Suitable metallic reflection layers are, for example, layers made of Al, Sn, Cu, Zn, Pt, Pd, Au, Ag, Cr, Ti, Ni, Mo, Fe or their alloys, such as e.g. Cu-Al, Cu-Sn, Cu-Zn, iron alloys, steel, stainless steel, metal compounds such as oxides or sulfides of metals such as copper oxide, aluminum oxide, zinc sulfide and the like.
    / 21
    .. ::: .. :: ·: &::
    • ····· · * · · *
    Suitable further functional layers are semiconducting layers, for example layers of inorganic semiconductors such as amorphous Si, metal oxide semiconductors such as e.g. ZnO (zinc oxide), InGaZnO (indium gallium zinc oxide), or other tertiary or quaternary compounds or also vapor-depositable molecular organic semiconductors from the group of the acenes such as e.g. Pentacen or from the group of thienoacenes such as e.g. dinaphtho [2,3b: 2 ', 3'-f] thieno [3,2-b] thiophene (DNTT) and benzothieno [3,2-b] [1] benzothiophene (BTBT) or from the group of fullerenes such as e.g. C60 or from the group of phthalocyanines such as e.g. Cu phthalocyanine or from the group of thiophenes such as PTCDI-C13 or blend materials such as PCBM-P3HT.
    Dielectric layers can also be used as the functional layer. Suitable dielectric layers are, for example, layers of CVD polymers such as parylene or polyethylene, or of oxide dielectrics such as Al2O3, ZrO2, T1O2 or S1O2 or of soluble polymers such as trimethylsilyl cellulose (TMSC) or polynorbornene diphenyl ester (PNDPE) or polyurethane acrylates (PUA). Suitable sensory layers are e.g. ferroelectric polymers from the group of polyvinylidene fluorides such as e.g. PVDF-TrFE or PVDF-TrFE-CFE.
    A suitable functional layer can also be carbon nanotubes (SWCNT) with either metallic or semiconducting properties.
    The functional layers can also be applied one after the other in any order in PVD or CVD processes and then removed together in a lift-off step over the microchannel areas.
    In the subsequent process step, the lift-off lacquer layer is removed by the action of an organic solvent or water at the same time as the functional layer above it.
    / 21
    The functional layer remains only in the area of the smooth surfaces on the embossing lacquer layer, since the lift-off lacquer layer was only deposited in the areas of the microchannels.
    This results in an exact match of the smooth areas of the lacquer layer with the functional layer without tolerances.
    The structure thus obtained can then optionally be provided with one or more protective lacquer layers or further functional layers. If necessary, the refractive index of the layer adjacent to the embossing lacquer layer can be matched to the refractive index of the embossing lacquer layer in order to prevent optical interactions with the microchannels.
    In the method according to the invention, a defined, locally limited wetting of different lacquers on a film surface is achieved by targeted pre-structuring by means of an embossing process. In combination with subsequent coating in a vacuum (e.g. sputtering, vapor deposition) or from solution and lift-off, this leads to the production of a self-adjusted, locally limited coating and wetting (e.g. in a printing process). In particular, this enables the self-aligned and selective coating of surfaces with sufficiently flat nanostructures or smooth surfaces by means of functional layers made of metals, metal oxides, inorganic and organic semiconductors or polymers.
    FIGS. 2a to 2e show the process sequence for producing the selectively coated diffractive structures or smooth surface areas.
    Where:
    smooth surface areas the microchannels / 21
    the embossing lacquer layer the lift-off lacquer layer the functional layer (here a reflective metallic layer or a semiconducting layer or a dielectric layer or a combination of these) a further layer the carrier substrate
    2a shows the surface structuring of the embossing lacquer layer 3 applied to a carrier substrate 7 with the smooth surface regions 1 and the microchannels 2.
    The microchannels have a V-shaped cross section and, depending on the thickness of the lacquer layer, have a depth of 15 to 30 μm and an opening width of 5 to 15 μm.
    2b shows the distribution of the lift-off lacquer 4 applied in the next method step in the microchannels 2, the surface in the area of the smooth areas not being wetted by the lift-off lacquer layer due to the wicking effect.
    2c, a full-surface reflective metallic layer 5 was applied to the embossing lacquer layer and the lift-off lacquer layer. This metallic layer can optionally already be partially applied, at least the smooth areas and partially the adjacent microchannels having to be provided with the metallic reflection layer.
    In FIG. 2d, the lift-off lacquer layer, together with the reflection layer 5 located above this lacquer layer, was affected by the action of a / 21:: ai: · :: ..::
    • · · · · ····
    Solvent or removed from water, the detachment can optionally be supported by mechanical action or ultrasound.
    The metallic reflection layer 5 is now absolutely congruent with the area of the smooth areas 1 on the embossing lacquer layer 3.
    2e shows the film element after application of a further layer 6, which can be a protective lacquer layer or a further functional layer.
    / 21
    Examples:
    Example 1:
    Embossing lacquer:
    m-% PEGDA (MW = 600 g / mol corresponding to approximately n = 10) m-% TMPTA m-% KL200
    Lift-off lacquer or “wash color”:
    Water soluble:
    m-% ACMO m-% KL200
    Process parameters application, embossing etc
    Example 2:
    m-% ACMO m-% PETTA m-% KL200
    Lift-off lacquer or “wash color”:
    Water soluble:
    m-% ACMO m-% KL200 / 21
    Example 3:
    Embossing lacquer:
    m% trifunctional UA oligomer e.g. Ebecryl 4820®% hexanediol diacrylate (HDDA)% KL200
    Lift-off lacquer:
    m-% IBOA m-% KL200
    The film elements according to the invention are used as optical elements, such as lenses, as light filters, electronic components, such as sensors, decorative elements and the like.
    权利要求:
    Claims (15)
    [1]
    1) Method for the selective coating of smooth surface areas of a film element comprising a lacquer layer with a functional layer characterized by the following method steps:
    a) Providing a carrier substrate
    b) applying a radiation-curable embossing lacquer layer with high surface energy
    c) introducing microchannels into at least a first partial area of the radiation-curable lacquer layer
    d) curing the radiation-curable lacquer layer
    e) Application of a lift-off lacquer layer which is soluble in a solvent or in water, this lacquer layer exclusively wetting and filling the microchannels.
    f) applying a functional layer,
    g) removing the paint layer which is soluble in a solvent or water by the action of a solvent or water.
    h) optionally applying one or more further functional layer (s) or protective lacquer layer (s).
    [2]
    2) Method according to claim 1, characterized in that as embossing lacquer UV-crosslinkable embossing lacquer compositions based on polyethylene glycol diacrylates (PEGDA), optionally with 1-10% by mass of higher functional acrylates, such as trimethylolpropane triacrylate (TMPTA) or pentaerythritol tetraacrylate (PETTA) or mixtures of acryloylmorpholine (ACMO) with 10 - 50% by mass of higher functional acrylates, such as trimethylolpropane triacrylate (TMPTA) or pentaerythritol tetraacrylate (PETTA) or coating systems based on highly cross-linking multifunctional polyester or polyurethane acrylate systems.
    15/21:: jls: ·:
    • · · · · · · · · · · ·· ·· ···· ··· ·· «·
    [3]
    3) Method according to one of claims 1 or 2, characterized in that as a lift-off lacquer hydroxyethyl caprolactone acrylate, ethoxyethoxyethyl acrylate, 2-ethoxyethyl acrylate,
    Tetrahydrofurfurylacrylate, gamma-butylolactone acrylate 4-acryloylmorpholine, hydroxypropyl acrylate, isobornyl acrylate, or isobornyl, cyclohexyl, tert-butyl, 4-tert-butylcyclohexyl, 3,3,5-trimethyl cyclohexyl, 1-adamantyl, 2, 2 -Methyl-2-adamantyl-, tetrahydrofuran (THF -) - acrylate or methacrylate can be used.
    [4]
    4) Method according to one of claims 1 to 3, characterized in that the embossing lacquer and the lift-off lacquer contain 0.5 - 5% photoinitiators.
    [5]
    5) Method according to one of claims 1 to 4, characterized in that the embossing lacquer and the lift-off lacquer contain photoinitiators based on acyl phosphine oxides, or oligomeric polyfunctional alpha hydroxy ketones or monomeric alpha hydroxy ketones.
    [6]
    6) Method according to one of claims 1 to 5, characterized in that the functional layer made of metals such as Al, Sn, Cu, Zn, Pt, Pd, Au, Ag, Cr, Ti, Ni, Mo, Fe or their alloys , such as Cu-Al, Cu-Sn, CuZn, iron alloys, steel, stainless steel, metal compounds, such as oxides or sulfides of metals, such as copper oxide, aluminum oxide, zinc sulfide.
    [7]
    7) Method according to one of claims 1 to 5, characterized in that the functional layer made of an inorganic semiconductor, such as amorphous Si, of metal oxide semiconductors such as e.g. ZnO (zinc oxide), InGaZnO (indium gallium zinc oxide), or other tertiary or quaternary compounds or from evaporable molecular compounds
    16/21
    .. ::: .. :: *: ιί>: · • · · · · · · · ♦ · · • · · · · · · · · ·· ·· ··· ·· ♦ · ·· ·· organic semiconductors from the group of acenes such as, for example Pentacen or from the group of thienoacenes such as e.g. dinaphtho [2,3-b: 2 ', 3'f] thieno [3,2-b] thiophene (DNTT) and benzothieno [3,2-b] [1] benzothiophene (BTBT) or from the group of fullerenes such as eg C60 or from the group of phthalocyanines such as e.g. Cu phthalocyanine or from the group of thiophenes such as PTCDI-C13 or blend materials such as PCBMP3HT. A suitable functional layer can also be carbon nanotubes (SWCNT) with either metallic or semiconducting properties.
    [8]
    8) Method according to one of claims 1 to 5, characterized in that the functional layer of a dielectric layer such as CVD polymers such as parylene or polyethylene, or of oxidic dielectrics such as Al2O3, ZrO2, T1O2 or S1O2 or from soluble polymers such as trimethylsilyl cellulose (TMSC) or polynorbornene diphenyl ester (PNDPE) or polyurethane acrylate (PUA).
    [9]
    9) Method according to one of claims 1 to 5, characterized in that the functional layer of a sensory layer of e.g. ferroelectric polymers from the group of polyvinylidene fluorides such as e.g. PVDF-TrFE or PVDF-TrFE-CFE exists.
    [10]
    10) Method according to one of claims 1 to 9, characterized in that the functional layer is deposited by a PVD or CVD method, for example by thermal evaporation, by sputtering or electron beam evaporation or from the liquid phase.
    [11]
    11) Method according to one of claims 1 to 10, characterized in that the depth-to-width ratio of the microchannels is> 1.
    17/21 • ♦ ♦ · · · * · · ί ♦ · ·· ···· ··· «a ··
    [12]
    12) Method according to one of claims 1 to 11, characterized in that the microchannels have a tapering cross section.
    [13]
    13) Method according to claim 12, characterized in that the microchannels have a V-shaped cross section
    [14]
    14) Method according to one of claims 1 to 13, characterized in that the selective coated surface is then provided with one or more functional layers and / or protective lacquer layers or adhesive layers.
    [15]
    15) Use of the film element produced according to one of claims 1 to 14 as optical elements such as microlenses or dielectric mirrors or light decoupling, light coupling or light directing structures, as light filters, as (opto) electronic components such as transistors, capacitors, memory elements or photovoltaic cells, as Sensors such as mechano-acoustic (loudspeaker) or acousto-mechanical (microphone) transducers as decorative elements.
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US4044177A|1976-03-25|1977-08-23|The Standard Products Company|Method of decorating an embossed plastic strip|
    DE102005041844A1|2005-09-02|2007-03-08|Mtu Aero Engines Gmbh|Process for coating or stripping a component|
    EP0358949A3|1988-09-15|1991-04-17|BASF Corporation|Multi-layer opalescent coatings containing pearlescent pigments and dyes|
    US7338704B2|2003-09-12|2008-03-04|Ppg Industries Ohio, Inc.|Coating composition having fluorescent colorants|
    US20080044627A1|2006-08-17|2008-02-21|Groseclose Rhea G|Reflective decorative surface coating and a decorative water-borne surface coating system having at least one basecoat|
    DE102008050605A1|2008-10-09|2010-04-15|Merck Patent Gmbh|coating process|CN109759289A|2019-01-29|2019-05-17|武汉华星光电技术有限公司|Alignment liquid apparatus for coating and alignment liquid coating method|
    AT523393B1|2020-04-06|2021-08-15|Hueck Folien Gmbh|Process for the production of a security element with a colored microstructure|
    法律状态:
    优先权:
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    EP18171006.2A| EP3404070B1|2017-05-16|2018-05-07|Composite structure with selective coating and production method|
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